HANDSKIT Tin Suction Wire Slag Removal Strip
SKU
14569
As low as $3.20
In stock
HANDSKIT Original Tin Suction Wire Slag Removal Strip Suitable for BGA Pad Removal Tool for Mobile Phone Motherboard Welding
Start 10pcs, order 50+ enjoy fast free shipping 6-9 days
Start 10pcs, order 50+ enjoy fast free shipping 6-9 days
Category: Tools
Features:
- It is refined with pure copper and a special chemical formula, ensuring fast, good, and economical operation.
- Used to absorb excess solder during tin removal, resistant to oxidation and corrosion, with good thermal conductivity and clean tin absorption.
- During disassembly and soldering, after the chip is removed, there will still be a large amount of solder on the circuit board, which will affect the soldering of the chip. Usually, a solder strip is used for cleaning.
- The method is to place a soldering iron on the solder strip and slowly move it on the chip solder pad.
- When the solder melts, it will be sucked up by the solder strip, absorbing the tin between the feet.
- This way, the cleaned printed board is very clean. Afterwards, use board washing water to clean the chip position on the machine board. Tin strips can be used for larger SMD components.
- Used to absorb excess solder during tin removal, resistant to oxidation and corrosion, with good thermal conductivity and clean tin absorption.
- During disassembly and soldering, after the chip is removed, there will still be a large amount of solder on the circuit board, which will affect the soldering of the chip. Usually, a solder strip is used for cleaning.
- The method is to place a soldering iron on the solder strip and slowly move it on the chip solder pad.
- When the solder melts, it will be sucked up by the solder strip, absorbing the tin between the feet.
- This way, the cleaned printed board is very clean. Afterwards, use board washing water to clean the chip position on the machine board. Tin strips can be used for larger SMD components.
Specification
Range of temperature regulation: 1℃
Operation temperature: 200 ℃
Melting point: 1000℃
Flux Content: 2%
Use to: Soldering BGA solder pad for mobile phone motherboard and removing tin
Operation temperature: 200 ℃
Melting point: 1000℃
Flux Content: 2%
Use to: Soldering BGA solder pad for mobile phone motherboard and removing tin
Wholesale Tips:
Order 50+ this tin suction wire, we will ship to you by DHL, Fedex or UPS by free and processing time within 1-3 business days. 
Dansarosa.com offer three shipping methods to worldwide, you could select on shopping cart or checkout page.
1. Free shipping: estimated shipping time 9-19 days (dispatch to address in Latin America, Africa. East Euro may cost 25-50 days, please allow additional time for shipments to P.O. boxes, or military addresses.)
2. Registered Mail: will take 9-19 days (dispatch to address in Latin America, Africa. East Euro may cost 25-50 days, please allow additional time for shipments to P.O. boxes, or military addresses.), shipment can be traced on line.
3. Express shipping: ships to all major destinations in 5-8 days (remote area may take more time and charges, if you have any question please contact [email protected]). Note: Due to longer customs clearance times, Standard Shipping times have been extended to 15-30 days for Brazil and 10-15 days for all other destinations in Latin America & East European.
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